Shenzhen Shinelink Technology Ltd

Shenzhen Shinelink Technology Ltd OEM PCB & PCBA Manufacturer (EMS Service)

Manufacturer from China
Active Member
7 Years
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Gerber File Multilayer Printed Circuit Board , Prototype Circuit Board Assembly

Gerber File Multilayer Printed Circuit Board , Prototype Circuit Board Assembly

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Brand Name :OEM ODM
Model Number :SL81104S18
Certification :UL, Rohs
Place of Origin :China
MOQ :No MOQ
Price :Negotiation
Payment Terms :T/T, Western Union, MoneyGram,Paypal
Supply Ability :30000pcs per day
Delivery Time :5-7 days
Packaging Details :ESD Bag
Sample order :Acceptable
Service available :OEM acceptable
Specialized in :High-precision
Features 1 :Gerber/PCB File Needed
Features 2 :100% E-test
Features 3 :Quality 2 Years Guarantee
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View Product Description

Gerber file multilayer pcb customed prototype printed circuit board

Multilayer PCB board

Shenzhen Shinelink Technology LTD. is a professional design company of printed circuit board and printed circuit board assembly manufacturing, dedicated to the Research ,Development,Production, Sales and Service of PCB and PCBA products for more than 14 years!

Advantages

- No MOQ

- OEM services provided

- Heavy copper PCB, Heavy gold PCB, Blind / Buried via PCB, High layer count PCB manufacturable

- Factory direct price

- Replying with price in one working day

- Shipping within 24 hours

- Certificate: ROHS, UL, ISO9001-2000, ISO14001,SGS Lead-Free

PCB Capacity

PCB General Capability

Number of Layer

1 - 18 Layer

Maximum Processing Area

680 × 1000MM

Min Board Thickness

2 Layer - 0.3MM ( 12 mil )

4 Layer - 0.4MM ( 16 mil )

6 Layer - 0.8MM ( 32 mil )

8 Layer - 1.0MM ( 40 mil)

10 Layer - 1.1MM ( 44 mil )

12 Layer - 1.3MM ( 52 mil )

14 Layer - 1.5MM ( 59 mil )

16 Layer - 1.6MM ( 63 mil )

18 Layer - 1.8MM ( 71 mil )

Finished Board Thickness Tolerance

Thickness ≤ 1.0MM, Tolerance: ± 0.1MM

1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10%

Twisting and Bending

≤ 0.75%, Min: 0.5%

Range of TG

130 - 215 ℃

Impedance Tolerance

± 10%, Min: ± 5%

Hi-Pot Test

Max: 4000V/10MA/60S

Surface Treatment

HASL, With Lead, HASL Free Lead

Flash Gold, Immersion Gold

Immersion Silver, Immersion Tin

Gold Finger, OSP

PCB Cu Thickness + Plating

Out Layer Cu Thickness

1 - 6OZ

Inner Layer Cu Thickness

0.5 - 4OZ

Cu Thickness of PTH

20UM ≤ Average ≤ 25UM

Min: 18UM

HASL with Lead

Tin 63% Lead 37%

HASL Free Lead

7UM ≤ Surface Thickness ≤ 12UM

Thick Gold Plating

Ni Thickness: 3 - 5UM ( 120u" - 200u" )

Gold Thickness: 0.025 - 1.27UM ( 1u" - 50u" )

Immersion Gold

Ni Thckness: 3 - 5UM ( 120u" - 200u" )

Gold Thickness: 0.025 - 0.15UM ( 1u" - 3u" )

Immersion Silver

Ag Thickness: 0.15- 0.75 UM ( 6u" - 30u" )

Gold Finger

Ni Thickness: 3 - 5UM ( 120u" - 160u" )

Gold Thickness: 0.025 - 1.51UM ( 1u" - 60u" )

U940 PCB Pattern Limit Capability

Min Width

0.075MM ( 3 mil )

Min Trace

0.075MM ( 3 mil )

Min Width of Ring ( Inner Layer )

0.15MM ( 6 mil )

Min Width of Ring ( Out Layer )

0.1MM ( 4 mil )

Min Solder Bridge

0.1MM ( 4 mil )

Min Height of Legend

0.7MM ( 28 mil )

Min Width of Legend

0.15MM ( 6 mil )

PCB Holes Processing Capability

Final Hole Size

Min: Laser 0.1MM, Machine 0.2MM

Drilling Hole Size

0.10 - 6.5MM

Drilling Tolerance

NPTH: ±0.05MM, PTH: ±0.075MM

Final Hole Size Tolerance ( PTH )

φ0.20 - 1.60MM ± 0.075MM

φ1.60 - 6.30MM ± 0.10MM

Final Hole Size Tolerance ( NPTH )

φ0.20 - 1.60MM ± 0.05MM

φ1.60 - 6.50MM ± 0.05MM

Drilling Strip Hole

-0L ~tu.'gth /width 2:1

Min Strip Hole Width 0.65MM

Length & Width Tolerance ± 0.05MM

Board Thickness / Hole Size

≤ 10:1

PCB Cover Thickness Capability

Solder Mask Color

Green,Matte Green,Yellow,Blue,Red,Black,Matte Black,White

Solder Mask Thickness

Surface Line ≥ 10UM

Surface Line Corner ≥ 6UM

Surface Board 10 - 25UM

Solder Mask Bridge Width

Legend Color

White,Yellow,Black

Min Height of Legend

0.70MM ( 28 mil )

Min Width of Legend

0.15MM ( 6 mil )

Blue Gel Thickness

0.2 - 1.5MM

Blue Gel Tolerance

±0.15MM

Carbon Print Thickness

5 - 25UM

Carbon Print Min Space

0.25MM

Carbon Print Impedance

200Ω

Blind/Burried/Half Via PCB Capability

Parameters

(1+1)e.g.

(4-layer)blind via:1-2,2-4

(6-layer)buried via:2-3,3-4

(8-layer)blind/buried:1-3,4-5,6-8

Min Via

Laser 0.1MM, Machine 0.2MM

Half Via

Min: 0.6MM

Impedance Capability

Resistance Value

Single-ended 50 - 75Ω, Difference 100Ω, Coplanar 50 - 75Ω

PCB Photos

Gerber File Multilayer Printed Circuit Board , Prototype Circuit Board AssemblyGerber File Multilayer Printed Circuit Board , Prototype Circuit Board Assembly

China Gerber File Multilayer Printed Circuit Board , Prototype Circuit Board Assembly for sale

Gerber File Multilayer Printed Circuit Board , Prototype Circuit Board Assembly

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