Shenzhen Shinelink Technology Ltd
Shenzhen Shinelink Technology Ltd OEM PCB & PCBA Manufacturer (EMS Service)
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Printed rigid PCB circuit board, Multilayer PCB board PCB assembly
Printed Circuit Board
1. Material:FR4, Printed pcb circuit board layout&produce
2. Competitive Price, High Quality
3. Fast delivery, OEM Parts
4. UL, SGS, Rohs Certificate
5. Good after Service, Express service
Your single point of contact for all of your raw materials, parts, and pcb assembly, also offers:
- Contract Manufacturing
- Engineering Services
- PCB Design & Assembly
- Product Design
- Prototyping
- Cable and Wire Assemblies
- Plastics and Molds
Detailed Specification of PCB Manufacturing
1) Layer:1-20 layer
2) Material:FR-4, CEM-1, CEM-3, Hight TG, FR4 Halogen Free, FR-1, FR-2
3) Board thickness:0.2mm-7mm
4) Max.finished board side:500mm*500mm
5) Min.drilled hole size:0.25mm
6) Min.line width:0.075mm(3mil)
7) Min.line spaceing:0.075mm(3mil)
8) Surface finish/treatment:HALS/HALS lead free, Chemical tin, Chemical Gold, Immersion gold Inmersion Silver/Gold, Osp, Gold Plating
9) Copper thickness:0.5-5.0oz
10) Solder mask color:green/black/white/red/blue/yellow
11) Inner packing:Vacuum packing, Plastic bag
12) Outer packing:Standard carton packing
13) Hole tolerance:PTH:±0.076, NTPH:±0.05
14) Certificate:UL, ISO9001, ISO14001, ROHS, CQC
15) Profiling Punching:Routing, V-CUT, Beveling
16) Assembly Service Providing OEM service to all sorts of printed circuit board assembly
Rigid PCB Feature
| Number of Layer | 1 - 20 Layer |
| Maximum Processing Area | 680 × 1000MM |
| Min Board Thickness | 2 Layer - 0.3MM ( 12 mil ) |
| 4 Layer - 0.4MM ( 16 mil ) | |
| 6 Layer - 0.8MM ( 32 mil ) | |
| 8 Layer - 1.0MM ( 40 mil) | |
| 10 Layer - 1.1MM ( 44 mil ) | |
| 12 Layer - 1.3MM ( 52 mil ) | |
| 14 Layer - 1.5MM ( 59 mil ) | |
| 16 Layer - 1.6MM ( 63 mil ) | |
| 18 Layer - 1.8MM ( 71 mil ) | |
| Finished Board Thickness Tolerance | Thickness ≤ 1.0MM, Tolerance: ± 0.1MM |
| 1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10% | |
| Twisting and Bending | ≤ 0.75%, Min: 0.5% |
| Range of TG | 130 - 215 ℃ |
| Impedance Tolerance | ± 10%, Min: ± 5% |
| Hi-Pot Test | Max: 4000V/10MA/60S |
| Surface Treatment | HASL, With Lead, HASL Free Lead |
| Flash Gold, Immersion Gold | |
| Immersion Silver, Immersion Tin | |
| Gold Finger, OSP |
PCB Picture
