Shenzhen Shinelink Technology Ltd
Shenzhen Shinelink Technology Ltd OEM PCB & PCBA Manufacturer (EMS Service)
Add to Cart
Access Control Electronic SMT PCB Assembly 4 Layers Fast Delivery
Our production capacity
| PCB Item | Manufacture Capacity |
| Layer Counts | 1--20L |
| Base Material | FR4,High-TG FR4,CEM3,aluminum,High Frequency(Rogers,Taconic,Aron,PTFE,F4B) |
| Material Thickness(mm) | 0.40, 0.60, 0.80, 1.00, 1.20, 1.50, 1.60, 2.0, 2.4, 3.2 |
| Max board size(mm) | 1200x400mm |
| Board Outline Tolerance | ±0.15mm |
| Board Thickness | 0.4mm--3.2mm |
| Thickness Tolerance | ±8% |
| Minimum line/space | 0.1mm |
| Min Annular Ring | 0.1mm |
| SMD Pitch | 0.3mm |
| Holes | |
| Min Hole Size(mechanical) | 0.2mm |
| Min Hole Size(laser hole) | 0.1mm |
| Hole Size Tol (+/-) | PTH:±0.075mm;NPTH: ±0.05mm |
| Hole Position Tol | ±0.075mm |
| Plating | |
| HASL/LF HAL | 2.5um |
| Immersion Gold | Nickel 3-7um Au:1-5u'' |
| Surface Finish | HAL,ENIG,Plated Gold,Immersion Gold,OSP |
| Copper | |
| Copper Weight | 0.5--6oz |
| Color | |
| Solder mask | Green, Blue, Black, White, Yellow, Red, Matt Green, Matt Black, Matt Blue |
| Silk screen | White, Black, Blue,Yellow |
| Acceptable File Format | Gerber file,Powerpcb,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000 |
| Certificate | ROSH,ISO9001,UL |
PCB Assembly Capability
| Stencil Size | 736x736mm |
| Minimum IC Pitch | 0.2mm |
| Maximum PCB size | 1200x 500mm |
| Minimum PCB thickness | 0.25mm |
| Minimum chip size: | 0201 (0.2x0.1)/0603 (0.6 x 0.3mm) |
| Maximum BGA size: | 74x74mm |
| BGA ball pitch: | 1.00mm (minimum), 3.00mm (maximum) |
| BGA ball diameter: | 0.40mm (minimum), 1.00mm (maximum) |
| QFP lead pitch: | 0.38mm (minimum), 2.54mm (maximum) |
| Volume: | One piece to low volume production quantities Low cost first article builds Schedule deliveries |
| Assembly type: | Surface mount(SMT) assembly DIP assembly Mixed(surface mount and through hole) technology Single or double sided placement Cable assembly |
| Components type: | Passive components: As small as 0402 package As small as 0201 with design review Ball Grid Arrays(BGA): As small as .5mm pitch |
| Parts procurements: | Turnkey(we supply the parts) Consigned(you supply the parts) You supply some parts, we do the rest |
| Solder type: | Leaded Lead-free/ROHS compliant |
| Other capabilities: | Repair/rework services Mechanical assembly Box build Mold and plastic injection. |
PCBA Picture
