Shenzhen Shinelink Technology Ltd

Shenzhen Shinelink Technology Ltd OEM PCB & PCBA Manufacturer (EMS Service)

Manufacturer from China
Active Member
8 Years
Home / Products / SMT PCB Assembly /

Multilayer SMT PCB Assembly Prototype Printed Circuit Board 2 Years Guarantee

Contact Now
Shenzhen Shinelink Technology Ltd
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MsSandy
Contact Now

Multilayer SMT PCB Assembly Prototype Printed Circuit Board 2 Years Guarantee

Ask Latest Price
Video Channel
Brand Name :OEM and ODM
Model Number :SL81023S006
Certification :UL,RoHS, CE
Place of Origin :China
MOQ :1pc
Price :Negotiable
Payment Terms :T/T, Western Union, MoneyGram,Paypal
Supply Ability :100000pcs per day
Delivery Time :5-7 days
Packaging Details :ESD package
Type :PCBA Prototype
Components :Qualified
SMT :Support
Features 1 :Gerber/PCB file needed
Features 2 :100% E-test
Features 3 :Quality 2 years guarantee
more
Contact Now

Add to Cart

Find Similar Videos
View Product Description

SMT Components Multilayer PCB Assembly Prototype Printed Circuit Board


LEAD TIME FOR PRODUCTION ORDERS

Sample Lead time

Mass production lead time

Single sided PCB

1~3

4~7

Double sided PCB

2~5

7~10

Multilayer PCB

7~8

10~15

PCB and Assembly

8~15

15~20



Features

1. One Stop OEM Service: Made in Shenzhen of China
2. Manufactured by Gerber File and Bom LIst Offered by Customers
3. SMT, DIP Technology Support
4. FR4 Material Meet 94v0 Standard
5. UL,CE,ROHS Compliant
6. Standard Lead Time: 4-5days for 2L;5-7 for 4L. Expedited Service is available



PCB Assembly Capability

Stencil Size

736x736mm

Minimum IC Pitch

0.2mm

Maximum PCB size

1200x 500mm

Minimum PCB thickness

0.25mm

Minimum chip size:

0201 (0.2x0.1)/0603 (0.6 x 0.3mm)

Maximum BGA size:

74x74mm

BGA ball pitch:

1.00mm (minimum), 3.00mm (maximum)

BGA ball diameter:

0.40mm (minimum), 1.00mm (maximum)

QFP lead pitch:

0.38mm (minimum), 2.54mm (maximum)

Volume:

One piece to low volume production quantities
Low cost first article builds
Schedule deliveries

Assembly type:

Surface mount(SMT) assembly
DIP assembly
Mixed(surface mount and through hole) technology
Single or double sided placement
Cable assembly

Components type:

Passive components:
As small as 0402 package
As small as 0201 with design review
Ball Grid Arrays(BGA):
As small as .5mm pitch

Parts procurements:

Turnkey(we supply the parts)
Consigned(you supply the parts)
You supply some parts, we do the rest

Solder type:

Leaded
Lead-free/ROHS compliant

Other capabilities:

Repair/rework services
Mechanical assembly
Box build
Mold and plastic injection.



PCBA Picture

Multilayer SMT PCB Assembly Prototype Printed Circuit Board 2 Years Guarantee







































Inquiry Cart 0