Shenzhen Shinelink Technology Ltd
Shenzhen Shinelink Technology Ltd OEM PCB & PCBA Manufacturer (EMS Service)
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Prepreg pcb prototype manufacturer 2layer PCB Green Solder resist color
Prepreg pcb
multilayer pcb
At present, multilayer pcb has been widely used in various electronic devices and it has become an important part among the electronic components owing to its mumerous advantages, such as high assembly density, small size ,good quality; reliability , flexibility , the constitution of a circuit with impedance; the formation of high-speed transmission circuit,the setup of shielding layer for electronic circuit and magnetic circuit,simple installation and so on.
PCB Design
Shenzhen PCB supplier
1. ONE-STOP-SERVICE
2. OEM service
3. Gerber file needed
4. PCB clone with sample
5. Quality guarantee and professional after-sell service
Our Production Capability for PCB / PWB
Layer: 1 to 18 layers
Material type: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
Board thickness: 0.21mm to 7.0mm
Copper thickness: 0.5 OZ to 7.0 OZ
Copper thickness in hole: >25.0 um (>1mil)
- Max. Board Size: 23 × 25 (580mm×900mm)
- Min. Drilled Hole Size: 3mil (0.075mm)
- Min. Line Width: 3mil (0.075mm)
- Min. Line Spacing: 3mil (0.075mm)
Surface finishing: HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
Solder Mask Color: Green/Yellow/Black/White/Red/Blue
Tolerance
- Shape tolerance: ±0.13
- Hole tolerance: PTH: ±0.076 NPTH: ±0.05
PCB Packing
- Inner packing: Vacuum packing / Plastic bag
- Outer packing: Standard carton packing
Certificate: UL, ISO 9001, ISO 14001
Special requirements: Buried and blind vias+controlled impedance +BGA
Profiling: Punching, Routing, V-CUT, Beveling
Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products.
PCB Capacity
| Item | Capability---Technology |
| Standard | IPC-A-610 E Class II-III |
| Laminate/Base Material | FR-4 / PI (FPC) / High TG FR-4 / Halogen Free material/Rogers/Arlon/ Taconic/Teflon/CEM-3/PTFE/Aluminum /BT |
| Layers | 1-18 |
| Finised inner/outer copper thickness | 1-6 OZ |
| Board Thinkness | 0.2-5.0mm |
|
Min hole size | Mechanical hole: 0.15mm |
| Laser hole: 0.1mm | |
| Min line width/space | 0.075mm/0.075mm |
| Min line Gap | +/-10% |
| Aspect Ratio | 12:1 |
| Controlled Impedance | <= +/-10% |
| Solder Mask Color | Green,Blue,Black,White,Yellow,Red,Grey,Purple etc.. |
| Outline profile | Rout/ V-cut/ Bridge/ Stamp hole |
| Surface treatment | HASL, HASL lead free, Immersion Gold,ENEPIG, Immersion Tin, Immersion Silver, Hard gold, Flash gold, OSP... |
| Tolerance of dimension size | +/-0.1mm |
| Capacity | 35000sq/Month |
| CAM Capability | 40 item |
PCB Photos
